Just before fabrication, the design flow of all integrated circuits (ICs) culminates in transistor-based, top-level simulations. Unfortunately, verifying functionality, connectivity, and performance ...

Almost every chip being taped out today is mixed-signal in nature. In addition to increased integration of analog and RF blocks, designers are using complex power-management techniques to minimize ...

Nothing is worse for a design team than a chip that fails to work in the bringup lab. Electrical problems are historically a major cause of such failures. Power leaks, power-ground DC paths, missing ...

WEST LAFAYETTE, Ind. - A simulation of electrical current moving through a futuristic electronic transistor has been modeled atom-by-atom in less than 15 minutes by Purdue University researchers. The ...

Three years ago, I wrote a blog entitled “Linking Virtual Wafer Fabrication Modeling with Device-level TCAD Simulation,” in which I described the seamless connection between the SEMulator3D virtual ...

As the digital semiconductor manufacturing process moves into the FinFET era, more and more front-end-of-line (FEOL) defects are observed due to extremely small feature size and complex manufacturing ...

China-based EDA leader Empyrean Technology and Shanghai UniVista Industrial Software Group have jointly announced their collaboration to build a digital-analog mixed design and simulation EDA solution ...

Before a chip design is turned from a hardware design language (HDL) like VHDL or Verilog into physical hardware, testing and validating the design is an essential step. Yet simulating a HDL design is ...

The different IBIS quality levels. The steps in the IBIS bench measurement procedure. Process for Quality Level 2a and Level 2b validation. The Input/Output Buffer Information Specification (IBIS) is ...