Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter ...

2.5D技术、3D技术、半导体先进封装、RDL（重布线层）、高性能介电材料、铜-铜混合键合技术、EMC（电磁兼容性）、MUF（多层膜结构）、中介层设计、玻璃基底材料、工艺、FOWLP（晶圆级扇出型封装）、FOPLP（面板级扇出型封装）、管芯堆叠技术、有机材料以及 ...

The MarketWatch News Department was not involved in the creation of this content. Enosemi Inc. ("Enosemi") and Jabil Inc. (NYSE: JBL) today announced a collaboration in advanced packaging process ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

Novel hybrid polymer “PET/F” expected to deliver enhanced performance compared with traditional PET plastic and have up to 100% bio content WEST SACRAMENTO, Calif. & BOLTON, Ontario--(BUSINESS ...

Industry consolidation and sustainability drive major changes as recycling challenges mount across global markets ...

2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...

The rising demand for sustainable options to petroleum-based plastics has made biopolymer food packaging an exciting area for ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

Advances in materials, tooling, and technology continue to blur the line between the most suitable process and a given application. Thermoforming, of course, can be used to make everything from ...