The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...

With the rapid rise of emerging technologies such as AI, high-performance computing (HPC) and 5G, demand for improved chip ...

Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...

A research team has developed the world's first eco-friendly silver (Ag) plating technology using a phosphorus (P) compound as a key plating component. This breakthrough technology enables silver ...