Abstract: In this paper we propose an anlge-of-arrival (AoA) estimation technique using the monopulse signal to achieve a reliable link for the ground-to-unmanned aerial vehicle (UAV) or UAV-to-UAV.

Abstract: Today's fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a ...